德律TR7600 SIII CT AXI檢測(cè)機(jī)系列為TRI新一代具指標(biāo)性的在線型PCBA檢測(cè)解決方案。TR7600SIII AXI檢測(cè)機(jī)包含可配合生產(chǎn)線速度達(dá)到99%檢測(cè)覆蓋率的設(shè)計(jì),結(jié)合了業(yè)界速的高解析取像速度,并在業(yè)界的自動(dòng)X光檢測(cè)中大大提升了影像品質(zhì)。
特性:
? 超高速3D CT X射線檢測(cè) ? *的影像品質(zhì) ? 真實(shí)3D錫點(diǎn)檢視 ? 高解析度可檢測(cè)小至01005in晶片 |
Imaging System
Camera | Ultra-High Speed Line-Scan CCD Cameras (3 or 5 Units) |
X-ray Source | Microfocus tube 130 kV max (user adjustable) |
Imaging Resolution | 7 μm, 10 μm, 15 μm, 20 μm (3 settings factory configured) |
Inspection Method | 2D, 2.5D, 3D Slicing, Planar CT |
Motion Table & Control
X-Axis Control | High-precision ballscrew + AC-servo controller |
Y-Axis Control | High-precision ballscrew + AC-servo controller |
Z-Axis Control | High-precision ballscrew + AC-servo controller |
X-Y Axis Resolution | 1 µm |
Board Handling
Max PCB Size | 900x460 mm |
PCB Thickness | 0.6-7 mm |
Max PCB Weight | 12 kg |
Top Clearance | @ 20 μm: 50 mm @ 15 μm: 30 mm @ 10 μm: 15 mm @ 7 μm: 7 mm |
Bottom Clearance | 70 mm |
Edge Clearance | 3 mm or 5 mm |
Conveyor Height | 880 - 920 mm * SMEMA Compatible |
Inspection Functions
Component | Missing Misalignment Tombstone Billboard Tantalum Polarity Rotation Floating |
Solder | Insufficient/Excess Solder Bridging Open Solder Ball Non-wetting Void Lifted Lead |
Dimensions
WxDxH | 1470 x 2110 x 1975 mm Note: not including signal tower, height: 510 mm |
Weight | 3850 kg |
Power Requirement | 200 - 240 VAC single phase, 50/60 Hz, 4 kVA |