The TR7600TL SIII is the new Inline line scan 3D AXI, with CT capabilities specialized, designed for the inspection of larger board sizes, up to 1200mm x 660mm. The TR7600TL SIII Series platform delivers exceptional speed and performance without compromising imaging resolution.
優(yōu)點:
? Ultra-High Speed 3D CT X-Ray Inspection
? Ultimate Resolution AXI for Large Boards
? Smart Programming with Robust Algorithms
Imaging System圖像系統(tǒng) | |
Camera相機 | Ultra-High Speed Line-Scan CCD Cameras (3 or 5 組) |
X-ray Source X光管 | Microfocus tube 130 kV max (可選) |
Imaging Resolution圖像分辨率 | 10 μm, 15 μm, 20 μm, 25 μm (可選) |
Inspection Method檢測方式 | 2D, 2.5D, 3D Slicing, Planar CT (可選) |
Motion Table & Control運動控制臺 | |
X-Axis Control X軸控制 | High-precision ballscrew + AC-servo controller高精度滾珠絲桿和AC伺服驅(qū)動 |
Y-Axis Control | |
Z-Axis Control | |
X-Y Axis Resolution X/Y軸分辨率 | 1 µm |
Board Handling | |
Max PCB Size PCB尺寸 | Standard: 610 x 660 mm |
2 Stages: 1200 x 660 mm | |
PCB Thickness PCB厚度 | 0.6-7 mm |
Max PCB Weight PCB重量 | 12 kg |
Top Clearance 間隙 | @ 25 μm: 50 mm |
@ 20 μm: 50 mm | |
@ 15 μm: 30 mm | |
@ 10 μm*: 15 mm | |
* For confirming the specific technical requirements, please contact TRI’s sales representative | |
Bottom Clearance 底部間隙 | @ 25 μm: 55 mm |
@ 20 μm: 70 mm | |
@ 15 μm: 70 mm | |
@ 10 μm: 70 mm | |
Edge Clearance 邊緣間隙 | 3 mm or 5 mm |
Conveyor Height 軌道高度 | 880 - 920 mm |
* SMEMA Compatible | |
Inspection Functions檢測功能 | |
Component 元件 | Missing 缺失 |
Misalignment 偏移 | |
Tombstone 立碑 | |
Billboard | |
Tantalum Polarity 反向 | |
Rotation旋轉(zhuǎn) | |
Floating 浮高 | |
Solder 錫膏 | Insufficient/Excess Solder 少錫/多錫 |
Bridging 橋連 | |
Open | |
Solder Ball 錫球 | |
Non-wetting | |
Void 無效 | |
Lifted Lead 翹腳 | |
Dimensions尺寸 | |
WxDxH 長寬高 | 2014 x 2000 x 1940 mm |
Note: not including signal tower, height: 510 mm | |
Weight 重量 | 4750 kg |
Power Requirement 電源 | 200 – 240 VAC, Three Phase, 50 / 60 Hz, 7 kVA. Optional: 346 – 416 VAC Three Phase Transformer |