MWIR成像機(jī)芯模塊Tachyon6400特點(diǎn)
偏置電壓:可選,0-4V
成像速度:500Hz (Core-s版本),2000Hz(Core-HS版本)
通訊接口:USB2.0,
數(shù)據(jù)傳輸: 原始數(shù)據(jù)10bit
采集觸發(fā):SMA 連接器,開(kāi)始/停止
外部觸發(fā):SMA連接器,1個(gè)脈沖一幅圖像
供電:12VDC,500mA, 6W
模塊尺寸:55Lx90Wx60H
金屬外殼:可選配(M35x1光學(xué)接口,80Lx90Wx80H mm
MWIR成像機(jī)芯模塊Tachyon6400應(yīng)用
氣體探測(cè)
機(jī)械視圖
激光監(jiān)測(cè)
炮口閃光探測(cè)
自動(dòng)保護(hù)系統(tǒng)
MWIR成像機(jī)芯模塊Tachyon6400規(guī)格參數(shù)
Module characteristics | |
---|---|
模塊 | 電子模塊通訊TACHYON 6400 FPA (2nd gen. FPA con ROIC, 80x80) |
FPA焦平面陣列 | 包括TACHYON 6400 FPA (2nd gen. FPA con ROIC, 80x80) |
型號(hào) | TACHYON 6400 CORE-S: 500 Hz &TACHYON 6400 CORE-HS: 2000 Hz |
積分時(shí)間 | Selectable, via software (100 us - 1000 us) |
探測(cè)器偏置電壓 | Selectable, via software (0 V - 4 V, with current measurement) |
幀頻 | TACHYON 6400 CORE-S: 500 Hz & TACHYON 6400 CORE-HS: 2000 Hz (*Note: slower frame rates are possible using longer integration times) |
接口 | USB 2.0 high-speed |
數(shù)據(jù)傳輸 | Raw data, 10 bits |
輸入觸發(fā) | Hardware, SMA connector, 2 modes: start/stop, burst |
外部觸發(fā) | Hardware, SMA connector, multiple modes |
電力 | External power, 12 VDC, 500 mA (6 W) |
附件 | Metallic housing with optical interface (M35x1) & Optics with optical interface (M35x1) & SDK library for C (ask for more information) |
FPA characteristics | |
傳感器材料 | VPD PbSe |
室溫表現(xiàn) | Uncooled |
FPA分辨率 | 6400 (80x80) |
像素大小 (微米) | 130x130 微米^2 |
像素對(duì)角線 (微米) | 135微米 |
FPA讀取方法 | Snapshot |
FPA數(shù)據(jù)格式 | Digital, 10 bits, raw |
FPA spectral characteristics | |
光譜范圍 | MWIR (1-5 microns, WLpeak @ 3.7 microns) |
光譜響應(yīng) | 1.0 - 5.0 microns |
WLpeak | 3.7 microns |
D* (WLpeak) (expected) | 2x10E9 Jones |
D* (-3dB) | 1.6 / 4.5 microns |
Time constant (us) | < 2 us |