詳情介紹：
超音波掃描光學(xué)顯微鏡D9600Z™ C?SAM®用以電源模塊查驗。 它是*早含有反過來傳感器的聲學(xué)光學(xué)顯微鏡，容許從底端掃描樣版。針對很多IGBT（絕緣層?xùn)烹p極三極管）模塊而言，底端掃描是必需的，在其中頂端構(gòu)件務(wù)必杜絕用以將超聲波從傳感器藕合到試品的水。D9600Z配備為根據(jù)2個環(huán)節(jié)另外查驗2個模塊，應(yīng)用SonoMatched™傳感器和WaterPlume™耦合器。將超音波單脈沖到熱管散熱器中，掃描傳感器接受操作員挑選的原材料界面的回音。雷達(dá)回波能夠在不一樣的界面上開展選通，比如在將熱管散熱器聯(lián)接到瓷器排到的焊錫絲上。因為反射面水準(zhǔn)十分高，此深層處的間隙、無粘接、縫隙或別的空隙在聲學(xué)統(tǒng)計數(shù)據(jù)上面顯示信息為亮乳白色。優(yōu)良融合的界面將是深灰色的。
實際操作工作人員可以在木筏、磨具附注、磨具或一切有關(guān)深層上設(shè)定水閘。根據(jù)應(yīng)用新的Polygate™手機(jī)軟件，操作員能夠挑選高達(dá)100個門——每一門都將顯示信息自身的聲學(xué)圖象。
這類多功能化大自然有利于對內(nèi)部缺點開展精準(zhǔn)剖析，并對層薄厚開展內(nèi)部測定，比如應(yīng)用Time Difference™模塊的電焊焊接層。此軟件模塊還投射樣版全部地域的薄厚轉(zhuǎn)變，并且以圖象方式顯示。 Maximum Flexibility for Detailed C-SAM® Inspections of Power Modules
The D9600Z incorporates the latest C-SAM® (C-Mode Scanning Acoustic Microscope) technology with enhanced features to accommodate the testing of Power Modules as well as to performing standard C-SAM operations. This new system configuration is optimized for inspection of heatsink bond integrity, thickness of bond layer and wire bond welds. Powered by our Sonolytics™ software platform with Polygate™ technology, the D9600Z™ is ideal for failure analysis, process development and QC screening in low-volume production environments.
Features:
? WaterPlume™ configuration scans from underneath, keeping the top surface of the power module dry.
? Available in Dual and Single WaterPlume configurations.
? Completely automated, including integrated drying of the module's bottom surface after testing.
? Visual PolyGate™ technology with Multi-Gate™ and Probing-Gate™ functions to detect: o Voids in the die attach, between the die and a ceramic insulator o Voids between the ceramic substrate and the base plate o Thickness of the bond layer o Cracks, chips and other defects in the copper clad ceramic substrate o Planarity of the die, insulator (raft) and base plate (heat sink) relative to each other
實際操作工作人員可以在木筏、磨具附注、磨具或一切有關(guān)深層上設(shè)定水閘。根據(jù)應(yīng)用新的Polygate™手機(jī)軟件，操作員能夠挑選高達(dá)100個門——每一門都將顯示信息自身的聲學(xué)圖象。
這類多功能化大自然有利于對內(nèi)部缺點開展精準(zhǔn)剖析，并對層薄厚開展內(nèi)部測定，比如應(yīng)用Time Difference™模塊的電焊焊接層。此軟件模塊還投射樣版全部地域的薄厚轉(zhuǎn)變，并且以圖象方式顯示。 Maximum Flexibility for Detailed C-SAM® Inspections of Power Modules
The D9600Z incorporates the latest C-SAM® (C-Mode Scanning Acoustic Microscope) technology with enhanced features to accommodate the testing of Power Modules as well as to performing standard C-SAM operations. This new system configuration is optimized for inspection of heatsink bond integrity, thickness of bond layer and wire bond welds. Powered by our Sonolytics™ software platform with Polygate™ technology, the D9600Z™ is ideal for failure analysis, process development and QC screening in low-volume production environments.
Features:
? WaterPlume™ configuration scans from underneath, keeping the top surface of the power module dry.
? Available in Dual and Single WaterPlume configurations.
? Completely automated, including integrated drying of the module's bottom surface after testing.
? Visual PolyGate™ technology with Multi-Gate™ and Probing-Gate™ functions to detect: o Voids in the die attach, between the die and a ceramic insulator o Voids between the ceramic substrate and the base plate o Thickness of the bond layer o Cracks, chips and other defects in the copper clad ceramic substrate o Planarity of the die, insulator (raft) and base plate (heat sink) relative to each other
