產(chǎn)品名稱 | PCSE | PCKL | PCR | PCS |
數(shù)據(jù)單號 | 906122 | 906123 | 906124 | 906125 |
特性 | 預先裝配的測量插件 | 堅固、防潮 | 可直接使用 | 出色的線性特征和高的穩(wěn)定性 |
應用場合 | 測量和控制、供暖、空調(diào)和通風、工業(yè)電子產(chǎn)品、家電、太陽能熱能 | |||
焊接 | - | - | - | 擴散膜工藝表面鍍鋅 |
測溫范圍 | -20-+150°C | -30-+150°C | -70-+300°C | -50-+150°C |
處理 | 軟釬焊 | 軟釬焊 | 壓接、焊接、硬焊 | 回流焊接、波峰焊 |
尺寸 | 4.3x15x2.2mm 4.1x28x2.2mm | 3.9x5x1.5mm | 3.8x15mm 4.8x15mm | 1.3x2.0x0.5mm,0815 1.5x3.1x0.8mm,1206 |
標稱值 | Pt100,Pt500,Pt1000 | Pt100,Pt1000 | Pt100,Pt500,Pt1000 | Pt100,Pt500,Pt1000 |
Standard | EN 60 751 |
Temperature coefficient | α = 3.850 x 10-3°C-1 (between 0 and 100°C) |
Temperature range | -50 to +150°C |
Tolerance | Temperature validity range Class B: -50 to +150°C |
Measuring current | Pt100 recommended: 1.0mA Pt500 recommended: 0.7mA Pt1000 recommended: 0.1mA |
Maximum current | Pt100 7.0mA Pt500 3.0mA Pt1000 1.0mA |
SMD size | Types PCS 1.1503.x (size 1206) and PCS 1.1302.x (size 0805) meet the requirements of CECC 40401-004/DIN 45 921. |
Processing | - Reflow soldering (soldering temperature/time ≤ 240°C/8sec) - Wave soldering (soldering temperature/time ≤ 260°C/10sec) |
Solder connections | Electro-tinned wrap-around contact with diffusion barrier, solderability, see IEC 68 Part 2 |
Operating conditions | Platinum-chip temperature sensors may not be used unprotected in humid ambient conditions or corrosive atmospheres. The user may have to carry out some checks before operation. Please also refer to the Installation Instructions B 90.6121.4 “Notes on the application of platinum-chip temperature sensors.” |
Long-term stability | max. R0 drift ≤ 0.05%/year (see Data Sheet 90.6000 for definitions) |
Insulation resistance | >10MΩ at room temperature |
Self-heating | Δt = I 2 x R x E (see Data Sheet 90.6000 for definitions) |
Packaging | * cardboard belt, small quantities can also be supplied loose in bags |
Storage | In the standard packaging, JUMO temperature sensors, PCS style, can be stored for at least 12 months under normal ambient conditions. It is not permissible to store the sensors in aggressive atmospheres, corrosive media, or in high humidity. |